Ledger · 2026-09-02 · Semiconductor Packaging / Power Electronics
Pressureless Micro-Silver-Indium ($\mu$Ag-In) TLP Sintering Paste via Mechanical Alloying
Cleared
This concept cleared all seven gates and every voiding sub-test.
| Incumbent benchmark | MacDermid Alpha Argomax 2148 |
| Entry application | Die-attachment of SiC MOSFETs to Direct Bonded Copper substrates in EV traction inverters |
| Measured advantage | >2.6x die shear strength after 1000h at 300°C under pressureless conditions (53 MPa vs <20 MPa for incumbent MacDermid Argomax 2148) |
| Time to first revenue | 9 months |
| Gross margin at parity | 73.4% |
| Startup CapEx | $150,000 |
| Payback from first sale | 0.1 months |
| Capital productivity | 360.0x |
| Regulatory risk | Moderate — qualification costs reported ($120,000 estimated) |
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Mechanism, operating protocol with real conditions and yields, computed unit economics with a six-scenario stress test, the absence audit, and every resolved citation.
Assessed 2026-09-02 against seven gates plus the voiding sub-tests. How the method works · Browse all concepts